Design for High Performance, Low Power, and Reliable 3D Integrated Circuits

Sung Kyu Lim

$384.95 $307.85

Hardback

Not in-store but you can order this
How long will it take?

Availability Information

We source books from suppliers in Australia and overseas. For books we don't currently have in stock, the time it takes to get them from our suppliers can vary widely - from a few days to a few months - so we check each book with each supplier to determine the expected time it will take to be supplied to us.

We then advise you accordingly. If the time taken to get any book is too long for you, you can let us know and we will cancel or adjust your order, and refund as required.

To find out the anticipated arrival time for specific items prior to ordering, please contact us by phone or email:

Phone +61 2 9264 3111, or 1800 4 BOOKS (1800 4 26657) if outside Sydney:
option 1 Abbey's Bookshop (Crime, History, Science, Kids & more) • info@abbeys.com.au
option 2 Language Book Centre (ESL & Foreign Languages) • language@abbeys.com.au
option 3 Galaxy Bookshop (Sci-fi, Fantasy, Romance, Graphic Novels) • sf@galaxybooks.com.au

QTY:

English

Springer-Verlag New York Inc.
25 November 2012

Precision instruments manufacture; Circuits & components

This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process.

By: Sung Kyu Lim
Imprint: Springer-Verlag New York Inc.
Country of Publication: United States
Edition: 2012
Dimensions: Height: 235mm, Width: 155mm, Spine: 36mm
Weight: 9.989kg
ISBN: 9781441995414
ISBN 10: 1441995412
Pages: 560
Publication Date: 25 November 2012
Audience: College/higher education , Further / Higher Education
Format: Hardback
Publisher's Status: Active

Regular vs Irregular TSV Placementfor 3D IC.- Steiner Routingfor 3D IC.- Buffer Insertion for 3D IC.- Low Power Clock Routing for 3D IC.- Power Delivery Network Design for 3D IC.- 3D Clock Routing for Pre-bond Testability.- TSV-to-TSV Coupling Analysis and Optimization.- TSV Current Crowding and Power Integrity.- Modeling of Atomic Concentration at the Wire-to-TSV Interface.- Multi-Objective Archetectural Floorplanning for 3D IC.- Thermal-aware Gate-level Placement for 3D IC.- 3D IC Cooling with Micro-Fluidic Channels.- Mechanical Reliability Analysis and Optimization for 3D IC.- Impact of Mechanical Stress on Timing Variation for 3D IC.- Chip/Package Co-Analysis of Mechanical Stress for 3D IC.- 3D Chip/Packaging Co-Analysis of Stress-Induced Timing Variations.- TSV Interfracial Crack Analysis and Optimization.- Ultra High Logic Designs Using Monolithic 3D Integration.- Impact of TSV Scaling on 3D IC Design Quality.- 3D-MAPS: 3DMassively Parallel Processor with Stacked Memory.

THE BIG SALE IS ON! TELL ME MORE

Design for High Performance, Low Power, and Reliable 3D Integrated Circuits

Sung Kyu Lim

$384.95 $307.85

Hardback

See Also

Contact Abbeys

Contact Galaxy

Contact Language

Contact Us

About ABBEY'S